Manufacturing specifications
PCB fabrication capabilities
Engineering-reviewed manufacturing. All specifications confirmed during quote review. Final capability, price, and lead time are subject to Gerber file analysis.
Board types
| Type | Layers | Description |
|---|---|---|
| Rigid FR-4 | 1-64 | Standard FR-4 laminate, 1-64 layers. Standard Tg 130, High Tg 150/170 available. |
| Flexible | 1-2 | Polyimide flexible circuits, adhesive-free. 1-2 layers with stiffener options. |
| Rigid-Flex | 2-16 | Combined rigid and flexible sections. Multilayer by engineering review. |
| Aluminum Core | 1 | Metal-core PCB for thermal management. 1W thermal conductivity. |
| Copper Core | 1 | High thermal conductivity (380W) for power applications. |
| High-Frequency | 1-8 | Rogers, PTFE Teflon, and ceramic substrates for RF/microwave. |
| Ceramic | 1-4 | High-temperature, high-frequency ceramic substrates. |
Dimensions
| Min board size | 5 × 5 mm |
|---|---|
| Max board size | 500 × 500 mm |
| Thickness options | 0.4, 0.6, 0.8, 1.0, 1.2, 1.6, 2.0 mm |
| Thickness tolerance | ±10% (≥1.0mm), ±0.1mm (<1.0mm) |
| Dimension tolerance | ±0.15 mm (routing) |
| Note | Larger sizes available by engineering review |
Materials
| Material | Tg |
|---|---|
| FR-4 Standard Tg 130 | 130°C |
| FR-4 High Tg 150 | 150°C |
| FR-4 High Tg 170 | 170°C |
| Polyimide | 250°C |
| Rogers 4350B | 280°C |
| PTFE Teflon | 327°C |
| Aluminum (1W/mK) | N/A |
| Copper (380W/mK) | N/A |
Copper weights & trace/spacing
| Copper | Min trace | Min spacing | Location |
|---|---|---|---|
| 1 oz | 0.1 mm (4 mil) | 0.1 mm (4 mil) | Outer |
| 2 oz | 0.16 mm (6.5 mil) | 0.16 mm (6.5 mil) | Outer |
| 3 oz | 0.25 mm (10 mil) | 0.25 mm (10 mil) | Outer |
| 0.5 oz | 0.09 mm | 0.09 mm | Inner |
| Available weights: Outer — 0.5 oz, 1 oz, 2 oz, 3 oz | Inner — 0.5 oz, 1 oz | Trace tolerance: ±20% | |||
Surface finishes
| Finish | Notes |
|---|---|
| Lead-free HASL | Standard finish |
| HASL (leaded) | Legacy finish |
| ENIG | Gold thickness 0.05-0.12 µm. Required for 6+ layers |
| OSP | Organic solderability preservative |
| Immersion Silver | Good for high-frequency |
| Immersion Tin | Flat surface, lead-free |
| Gold Fingers | Hard gold edge connectors |
Solder mask
| Type | LPI (Liquid Photo-Imageable), heat-cured |
|---|---|
| Thickness | ≥10 µm |
| Colors | Green, Blue, Black, Red, White, Yellow |
| Min bridge | green: 0.1mm blue: 0.1mm red: 0.1mm yellow: 0.1mm black: 0.13mm white: 0.13mm |
Silkscreen
| Colors | White, Black |
|---|---|
| Min line width | 0.15 mm |
| Min text height | 1 mm |
| Character ratio | 1:6 minimum |
Drilling & vias
| Min drill (multilayer) | 0.15 mm |
|---|---|
| Min drill (single layer) | 0.3 mm |
| Max drill | 6.3 mm |
| PTH tolerance | +0.13 / -0.08 mm |
| NPTH tolerance | ±0.05 mm |
| Position tolerance | ±0.05 mm |
| Via types | Through-hole, Tented, Plugged, Filled |
| Min castellated hole | 0.5 mm |
| Blind/buried vias | By engineering review |
Advanced processes
| Process | Description |
|---|---|
| Impedance control Available | Controlled impedance ±10%. Available on 4+ layers. |
| Edge plating Available | Copper plating on board edge. By engineering review. |
| Castellated holes Available | Min 0.50 mm diameter. Plated half-holes on board edge. |
| HDI Available | Microvias and high-density interconnect. By engineering review. |
| Countersink Available | Countersunk holes for flush mounting. |
| Backdrill Available | Removes unused via stubs. 4-32 layers, thickness ≥0.8mm. |
| Panelization Available | V-score, tab routing, or mouse bites. |
Testing & quality
| Test | Description | Default |
|---|---|---|
| AOI | Automated Optical Inspection. Standard on all boards. | Standard |
| Flying Probe | Full electrical test. Recommended for prototypes and small runs. | Optional |
| Fixture Test | Dedicated test fixture. For production volumes. | Optional |
| Random Test | Sample-based electrical test. Free, 99% pass rate. | Standard |
| Impedance Test | TDR coupon measurement. With impedance control boards. | Optional |
Inspection: IPC-A-600 Class 2 (Class 3 by request) |
Certification: ISO 9001 |
Quality rate: 99%+ (target)
PCB Assembly (PCBA)
Assembly types
| Type | Description |
|---|---|
| SMT — Top side only | Surface mount on top side. Standard for single-sided designs. |
| SMT — Bottom side only | Surface mount on bottom side. |
| SMT — Both sides | Surface mount on both top and bottom. Requires two-pass reflow. |
| Through-hole only | Manual or wave soldered through-hole components. |
| Mixed SMT + Through-hole | Combined SMT and through-hole assembly. Most common for production. |
Component sourcing
| Customer supplied | You provide all components. We assemble. |
| NeoGiga sourced | We source all components from the NeoGiga catalog and global distributors. |
| Mixed | You provide critical/rare parts. We source the rest. |
Stencil options
| Framed stencil | Laser-cut 304 HTA steel, 0.10-0.20mm thickness. For production runs. |
| Frameless stencil | Prototype-grade, same precision. Cost-effective for small batches. |
| Nano stencil | Ultra-fine pitch, 0201 and micro-BGA capable. ±0.003mm precision. |
Testing
| Type | Default |
|---|---|
| Visual inspection | Standard |
| AOI | Optional |
| X-Ray | Optional |
| Functional test | Optional |
Min component: 0201 (imperial) |
BGA: Supported |
Lead-free: Standard
Turnaround: 3-5 days after PCB fabrication (standard) |
24-48 hours after PCB fabrication (express)
Customer-supplied components must be in original packaging with moisture protection.
Lead times
5-15d
Standard — Standard fabrication
3-10d
Fast — Accelerated processing
2-5d
Express — Priority engineering and fabrication
Engineering review required. All specifications are confirmed during the quote process after Gerber file analysis. Contact pcb@neogiga.com for capabilities not listed here.